Manufacturing process of pcb board

1. Cutting (CUT)

Cut the initial copper clad laminate into boards.

2. Drilling

According to the material, drill holes in the corresponding position on the sheet.

3. Immersion copper

A thin layer of copper is chemically deposited on the walls of the insulating holes.

4. Graphic transfer

Let the image on the production film be transferred to the board.

5. Graphic plating

Let the copper layer of the hole and the line be plated to a certain thickness (20-25um), and finally meet the requirements of the copper thickness of the final PCB board.

6. Withdraw the film

Use NaOH solution to expose the non-line copper layer where the anti-plating cover film layer was removed.

7. Etching

The copper layer of the non-circuit part is etched away by chemical reaction method.

8. Green oil

Transferring the graphics of the green film to the board can protect the circuit and prevent tin on the circuit when soldering parts.

9. Silkscreen characters

Print the required text and information on the board.

10. Surface treatment

Because bare copper is easily oxidized by moisture if it is exposed to the air for a long time, surface treatment is required. Common surface treatments include tin spraying, immersion gold, OSP, immersion tin, immersion silver, nickel palladium gold, electrohard gold, electric gold fingers, etc. .

11. Molding

Let the PCB be cut to the desired dimensions with a CNC molding machine.

12. Test

Check the state of the analog board to see if there are any defects such as short circuits.

13. Final inspection

Check the board appearance, size, hole diameter, board thickness, marks, etc.

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