FPC patch processing process and precautions

FPC patch processing process and precautionsFPC chip processing needs to provide information1. Complete FPC board making documents (Gerber files, layout diagrams, steel mesh files) and board making requirements;2. Complete BOM (including model, brand, package, description, etc.);3. PCBA assembly drawing.PS: To report the PCBA functional test fee, you need to provide the PCBA functional test method.FPC patch processing process1. Pretreatment;2. Fixed;3. Printing;4. SMD;5. Reflow soldering;6. Testing;7. Inspection;8. Sub-board.Precautions for FPC patch processing1. FPC fixing: From printing and patching to reflow soldering, it is fixed on the supporting board. The supporting board used requires a small thermal expansion coefficient.2. Solder paste printing: because FPC is loaded on the pallet, and there is a high-temperature-resistant tape for positioning on the FPC, which makes the height inconsistent with the plane of the pallet, so an elastic scraper must be used for printing. The solder paste composition has a great influence on the printing effect, and must Choose the appropriate solder paste.3. Mounting equipment: First, the solder paste printing machine should preferably have an optical positioning system, otherwise the soldering quality will be greatly affected. Secondly, the FPC is fixed on the supporting board, but there will always be some tiny gaps between the FPC and the supporting board, which is the biggest difference from the PCB substrate. Therefore, the setting of equipment parameters will have a great impact on printing effect, mounting accuracy and welding effect.

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