Packaging System
Packaging System
Package System Design
Signal/Power Integrity Modeling
Package System 3D Mechanical Modeling
Packaging pcb Assembly & Test
SIndustry Focused Package Systems Integration
Package System Design
Custom Package System design including substrate selection/routing, package assembly structure definition (PoP, SiP, single die, etc.) meeting industry specific DFM & reliability requirements (Deliverables: 2D DXF & Various Design Files).
Signal/Power Integrity Modeling
PCB & Package system, passive interconnect, electrical signal & power modeling (Deliverables: SI/PI Report & Program Files).
Arisentec substrate division delivers full interconnect
solutions from SI/PI modeling, interconnect routing & fabrication.
Full Package Modeling & Design Service
5 & 7 Day BGA/CSP Quick Turn Fabrication
Ultra-Thin “Coreless” Package Structures
Ceramic On Organic Laminate (COOL) Package Product Launch
Full Package SiP Product Solutions
Package System 3D Mechanical Modeling
Package System 3D mechanical design (Deliverables: 3D STEP Files).
Packaging Assembly & Test ( Product Fabrication / Manufacturing )
Substrate fabrication integrated with package pcb assembly/test (Deliverable: Fully tested packaged components).
Industry Focused Package Systems Integration
B2B Package Systems, technology & supply program management / development from NPI, production ramp, to high volume manufacturing of high power, high speed package systems showing calculated improvement of customer’s corporate ROA components (Deliverable: A calculated improvement of customers ROA components including impact on Revenue, SG&A, COGS, Fix/Current Asset).
