Packaging System
Packaging System
![Package System Design Package System Design](https://arisentecpcb.com/wp-content/uploads/elementor/thumbs/Package-System-Design-qco2nao4m9s1vj21255jaaxmn0p6v3tnbmxvif6t4w.png)
Package System Design
![Signal-Power-Integrity-Modeling Signal-Power-Integrity-Modeling](https://arisentecpcb.com/wp-content/uploads/elementor/thumbs/Signal-Power-Integrity-Modeling-qco2pyjnzdfarr6rialhcmqn8bkmo8e9othegn8ni8.png)
Signal/Power Integrity Modeling
![Package-System-3D-Mechanical-Modeling Package-System-3D-Mechanical-Modeling](https://arisentecpcb.com/wp-content/uploads/elementor/thumbs/Package-System-3D-Mechanical-Modeling-qco2pji8y0uplzsly43g8qj9q5mr92qkar1ms7uy9s.png)
Package System 3D Mechanical Modeling
![Packaging Assembly & Test Packaging Assembly & Test](https://arisentecpcb.com/wp-content/uploads/elementor/thumbs/Packaging-Assembly-Test-qco2rixzdfki4cwucyz3i8iavfuni2m5wkmj98x14w.png)
Packaging pcb Assembly & Test
![SIndustry Focused Package Systems Integration SIndustry Focused Package Systems Integration](https://arisentecpcb.com/wp-content/uploads/elementor/thumbs/SIndustry-Focused-Package-Systems-Integration-qco2temd1i55ca6jds88hrfhn6l2wa2u5vlht64oow.png)
SIndustry Focused Package Systems Integration
![](https://arisentecpcb.com/wp-content/uploads/2023/09/en-services-streamer1.jpg)
Package System Design
Custom Package System design including substrate selection/routing, package assembly structure definition (PoP, SiP, single die, etc.) meeting industry specific DFM & reliability requirements (Deliverables: 2D DXF & Various Design Files).
Signal/Power Integrity Modeling
PCB & Package system, passive interconnect, electrical signal & power modeling (Deliverables: SI/PI Report & Program Files).
![](https://arisentecpcb.com/wp-content/uploads/2023/09/en-services-streamer2.jpg)
Arisentec substrate division delivers full interconnect
solutions from SI/PI modeling, interconnect routing & fabrication.
Full Package Modeling & Design Service
5 & 7 Day BGA/CSP Quick Turn Fabrication
Ultra-Thin “Coreless” Package Structures
Ceramic On Organic Laminate (COOL) Package Product Launch
Full Package SiP Product Solutions
![](https://arisentecpcb.com/wp-content/uploads/2023/09/Package-System-3D-Mechanical-Modeling.jpg)
Package System 3D Mechanical Modeling
Package System 3D mechanical design (Deliverables: 3D STEP Files).
Packaging Assembly & Test ( Product Fabrication / Manufacturing )
Substrate fabrication integrated with package pcb assembly/test (Deliverable: Fully tested packaged components).
![](https://arisentecpcb.com/wp-content/uploads/2023/09/en-services-streamer4.jpg)
![](https://arisentecpcb.com/wp-content/uploads/2023/09/en-services-streamer5.jpg)
Industry Focused Package Systems Integration
B2B Package Systems, technology & supply program management / development from NPI, production ramp, to high volume manufacturing of high power, high speed package systems showing calculated improvement of customer’s corporate ROA components (Deliverable: A calculated improvement of customers ROA components including impact on Revenue, SG&A, COGS, Fix/Current Asset).